? semiconductor components industries, llc, 2011 august, 2011 ? rev. 15 1 publication order number: mc74vhc1gt66/d mc74vhc1gt66 spst (no) normally open analog switch the mc74vhc1gt66 is a single pole single throw (spst) analog switch. it achieves high speed propagation delays and low on resistances while maintaining low power dissipation. this bilateral switch controls analog and digital voltages that may vary across the full power ? supply range (from v cc to gnd). the mc74vhc1gt66 is compatible in function to a single gate of the high speed cmos mc74vhct4066 and the metal ? gate cmos mc14066. the device has been designed so that the on resistances (r on ) are much lower and more linear over input voltage than r on of the metal ? gate cmos or high speed cmos analog switches. the on/off control input is compatible with ttl ? type input thresholds allowing the device to be used as a logic ? level translator from 3 v cmos logic to 5 v cmos logic or from 1.8 v cmos logic to 3 v cmos logic while operating at the high ? voltage power supply. the input protection circuitry on this device allows overvoltage tolerance on the input, which provides protection when voltages of up to 7 v are applied, regardless of the supply voltage. this allows the mc74vhc1gt66 to be used to interface 5 v circuits to 3 v circuits. features ? high speed: t pd = 20 ns (typ) at v cc = 5 v ? low power dissipation: i cc = 1.0 a (max) at t a = 25 c ? diode protection provided on inputs and outputs ? improved linearity and lower on resistance over input voltage ? on/off control input has ovt ? chip complexity: fets = 11; equivalent gates = 3 ? pb ? free packages are available pin assignment 1 2 3 gnd in/out x a out/in y a 4 5v cc on/off control function table see detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. ordering information l h on/off control input state of analog switch off on marking diagrams http://onsemi.com sc ? 88a df suffix case 419a tsop ? 5 dt suffix case 483 1 5 1 5 1 5 ve m ve = device code m = date code* w = work week = pb ? free package (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location. 1 5 ve m m
mc74vhc1gt66 http://onsemi.com 2 v cc in/out x a out/in y a on/off control gnd figure 1. pinout diagram on/off control out/in y a 1 u u in/out x a 1 x 1 figure 2. logic symbol 1 2 3 4 5 (sc ? 88a, tsop ? 5) maximum ratings symbol characteristics value unit v cc dc supply voltage ? 0.5 to +7.0 v v in dc input voltage ? 0.5 to +7.0 v v is analog output voltage ? 0.5 to 7.0 v i ik input diode current ? 20 ma i cc dc supply current, v cc and gnd +25 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance sc70 ? 5 (note 1) sot23 ? 5 350 230 c/w p d power dissipation in still air at 85 csc70 ? 5 sot23 ? 5 150 200 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) 2000 200 n/a v i latchup latchup performance above v cc and below gnd at 125 c (note 5) 500 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ? ounce copper trace with no air flow. 2. tested to eia/jesd22 ? a114 ? a. 3. tested to eia/jesd22 ? a115 ? a. 4. tested to jesd22 ? c101 ? a. 5. tested to eia/jesd78.
mc74vhc1gt66 http://onsemi.com 3 recommended operating conditions symbol characteristics min max unit v cc dc supply voltage 2.0 5.5 v v in digital input voltage gnd 5.5 v v is analog input voltage gnd v cc v t a operating temperature range ? 55 +125 c t r , t f input rise and fall time v cc = 3.3 v 0.3 v v cc = 5.0 v 0.5 v 0 0 100 20 ns/v device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 time, years normalized failure rate t j = 130 c failure rate of plastic = ceramic until intermetallics occur figure 3. failure rate vs. time junction temperature t j =120 c t j =110 c t j =100 c t j = 90 c t j = 80 c
mc74vhc1gt66 http://onsemi.com 4 dc electrical characteristics symbol parameter test conditions v cc (v) t a = 25 c t a 85 c ? 55 c t a 125 c unit min max min max min max v ih minimum high ? level input voltage on/off control input r on = per spec 3.0 4.5 5.5 1.2 2.0 2.0 1.2 2.0 2.0 1.2 2.0 2.0 v v il maximum low ? level input voltage on/off control input r on = per spec 3.0 4.5 5.5 0.53 0.8 0.8 0.53 0.8 0.8 0.53 0.8 0.8 v i in maximum input leakage current on/off control input v in = v cc or gnd 0 to 5.5 0.1 1.0 1.0 a i cc maximum quiescent supply current v in = v cc or gnd v io = 0 v 5.5 1.0 20 40 a i cct quiescent supply current on/off control at 3.4 v 5.5 1.35 1.5 1.65 ma r on maximum ?on? resistance v in = v ih v is = v cc or gnd |i is | 10 ma (figure 4) 3.0 4.5 5.5 60 45 40 70 50 45 100 60 55 i off maximum off ? channel leakage current v in = v il v is = v cc or gnd switch off (figure 5) 5.5 0.1 0.5 1.0 a ac electrical characteristics c load = 50 pf, input t r /t f = 3.0 ns symbol parameter test conditions v cc (v) t a = 25 c t a 85 c ? 55 c t a 125 c unit min typ max min max min max t plh , t phl maximum propagation delay, input x to y y a = open (figures 7, 14) 2.0 3.0 4.5 5.5 1 0.6 0.6 0.6 5 2 1 1 6 3 1 1 7 4 2 1 ns t plz , t phz maximum propagation delay, on/off control to analog output r l = 1000 (figures 8, 15) 2.0 3.0 4.5 5.5 32 28 24 20 40 35 30 25 45 40 35 30 50 45 40 35 ns t pzl , t pzh maximum propagation delay, on/off control to analog output r l = 1000 (figures 8, 15) 2.0 3.0 4.5 5.5 32 28 24 20 40 35 30 25 45 40 35 30 50 45 40 35 ns c in maximum input capacitance on/off control input 0.0 3 10 10 10 pf control input = gnd analog i/o feedthrough 5.0 4 4 10 10 10 10 10 10 c pd power dissipation capacitance (note 6) typical @ 25 c, v cc = 5.0 v pf 18 6. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no ? load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
mc74vhc1gt66 http://onsemi.com 5 additional application characteristics (voltages referenced to gnd unless noted) symbol parameter test conditions v cc limit 25 c unit bw maximum on ? channel bandwidth or minimum frequency response (figure 10) f in = 1 mhz sine wave adjust f in voltage to obtain 0 dbm at v os increase f in = frequency until db meter reads ? 3 db r l = 50 3.0 4.5 5.5 150 175 180 mhz iso off off ? channel feedthrough isolation (figure 11) f in = sine wave adjust f in voltage to obtain 0 dbm at v is f in = 10 khz, r l = 600 3.0 4.5 5.5 ? 80 ? 80 ? 80 db noise feed feedthrough noise control to switch (figure 12) v in 1 mhz square wave (t r = t f = 2ns) r l = 600 3.0 4.5 5.5 45 60 130 mv pp thd total harmonic distortion (figure 13) f in = 1 khz, r l = 10 k thd = thd measured ? thd source v is = 3.0 v pp sine wave v is = 5.0 v pp sine wave 3.3 5.5 0.30 0.15 % figure 4. on resistance test set ? up figure 5. maximum off ? channel leakage current test set ? up 5 1 2 4 3 figure 6. maximum on ? channel leakage current test set ? up figure 7. propagation delay test set ? up power supply computer dc parameter analyzer v cc + ? plotter 5 1 2 4 3 v cc v il v cc v cc a 5 1 2 4 3 v cc v ih v cc a n/c 5 1 2 4 3 v cc v ih test point v ih
mc74vhc1gt66 http://onsemi.com 6 figure 8. propagation delay output enable/disable test set ? up figure 9. power dissipation capacitance test set ? up 5 1 2 4 3 v cc v cc v cc 2 1 2 1 r l c l * *includes all probe and jig capacitance. 5 1 2 4 3 v cc n/c n/c test point switch to position 2 when testing t plz and t pzl switch to position 1 when testing t phz and t pzh a figure 10. maximum on ? channel bandwidth test set ? up figure 11. off ? channel feedthrough isolation test set ? up figure 12. feedthrough noise, on/off control to analog out, test set ? up figure 13. total harmonic distortion test set ? up 5 1 2 4 3 v cc *includes all probe and jig capacitance. db meter 0.1 f v os f in 5 1 2 4 3 v cc *includes all probe and jig capacitance. db meter 0.1 f v os f in r l v is 5 1 2 4 3 v cc *includes all probe and jig capacitance. v os (v cc )/2 i s r l r l gnd v ih v in 1mhz t r t f 2ns 5 1 2 4 3 v cc *includes all probe and jig capacitance. 0.1 f v is f in v os to distortion meter (v cc )/2 r l v ih
mc74vhc1gt66 http://onsemi.com 7 v cc v oh 1.5 v 50% v cc x a y a t phl t plh figure 14. propagation delay, analog in to analog out waveforms figure 15. propagation delay, on/off control 1.5 v v ol v ih 10% 50% v cc control analog out t plz t pzl 50% v cc 1.5 v t phz t pzh v ol v oh high impedance high impedance 90% t r t f 90% 10% ordering information device package shipping ? m74vhc1gt66dft1g sc ? 88a (pb ? free) 3000 / tape & reel mc74vhc1gt66dft2 sc ? 88a m74vhc1gt66dft2g sc ? 88a (pb ? free) mc74vhc1gt66dtt1 tsop ? 5 m74vhc1gt66dtt1g tsop ? 5 (pb ? free) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc74vhc1gt66 http://onsemi.com 8 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a ? 01 obsolete. new standard 419a ? 02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ? b ? sc ? 88a (sc ? 70 ? 5/sot ? 353) case 419a ? 02 issue k mm inches scale 20:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748
mc74vhc1gt66 http://onsemi.com 9 package dimensions tsop ? 5 case 483 ? 02 issue h notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 l 1.25 1.55 m 0 10 s 2.50 3.00 123 54 s a g l b d h c j 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 t seating plane 0.05 k m detail z detail z on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?t ypicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license un der its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended f or surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in a ny manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mc74vhc1gt66/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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